DGP8761

Loading Configuration Open Cassette Is System On-Line? Yes CE Mark Certified? Yes OEM Audit Available? Yes Can Produce Wafers AS IS? Yes Any Known Field Modifications? Yes All Cables Present? Yes GEM/SECS Interface  Yes SECS II Interface Yes Standard Network Communication Capability Yes

System Configuration Model Type DTU DTU1553 Temperature control Yes

Key Common Options  Included? Clean Room Manuals Yes Standard Manuals Yes

Machine Configuration UPS Yes Main power supply Yes Turn table float amount Yes Exhaust pressure Yes Individual unit initialization Yes Z2-axis spindle parallelism  Yes Z2-axis inclination adjustment (on the C/T axis) Yes Z3-axis inclination adjustment (on the C/T axis) Yes C/T centering and installation Yes Performing self-grinding Yes Z2-axis inclination (on the C/T)  Yes Z1-axis inclination (on the C/T)  Yes Z3-axis inclination (on the C/T) auto setup operation (Option)  Yes IPG origin position adjustment Yes NCG setup (Option) Yes Nozzle adjustment Yes T1 adjustment Yes T2 adjustment Yes Z2 Spindle Flat Position  Yes Z2 C/T Inclination  Yes Z2 C/T Inclination  Yes

Including DTU1550

1. FOUP/mapping function available or not: not supported. 2. Support for 12 inch parts or not: no 12inch parts. 3. Whether both chuck tables are 8/12 inch: 6” chuck but capable of adopting 12” chuck 4. Whether both spindles are 8/12 inch: 12” base 5. Z3 spindle for grind or polish: All spindles are grind and not capable of using polish on Z3 with POR condition. 6. Presence of vacuum unit: includes vacuum pump 7. Presence of dust collection unit: includes dust collection unit